Program Chairs (for Technical Program Inquiries)
Elisa
Bertino, Purdue
University, USA
at Bertino@cs.purdue.edu Vladimir
Getov, University
of Westminster, UK
at V.S.Getov@westminster.ac.uk
Lin
Liu, Tsinghua
University, China
at linliu@tsinghua.edu.cn
Best Practice Track Co-Chairs
Darren Kerbyson, Los Alamos National Laboratory, USA
Jenny Li, Avaya Labs, USA
Education and Learning Track Co-Chairs
Hussein Zedan, De Montfort University, UK
James Cross, Auburn University, USA
Embedded Systems Track Co-Chairs
Tiberiu Seceleanu,
ABB Corporate Research, Sweden
Bruce McMillin ,
Missouri University of Science and Technology, , USA
Formal Methods Track Co-Chairs
Michele Bugliesi, University of Venice, Italy
Cristina Seceleanu, Malardalen University, Sweden
Location Based Services Track Co-Chairs
Sumi Helal, University of Florida, USA
Paolo Bellavista, University of degli Studi di
Bologna, Italy
Axel Kupper, Ludwig Maximilians
University Munich, Germany
Quality Track Co-Chairs
Ron Kenett, KPA,
Israel
Joao Cangussu, University
of Texas at Dallas, USA
Requirements Track Co-Chairs
Eric Dubois, CRP Henry Tudor, Luxembourg
Eric Yu, University of
Toronto, Canada
Security Track Co-Chairs
Virgil Gligor, University
of Maryland at College
Park, USA
Jan Camenisch, IBM Research Zurich,
Switzerland
Social & Collaborative Networks Track Co-Chairs
Murat Kantarcioglu, University
of Texas, Dallas, USA
James Joshi, University of
Pittsburgh, USA
Software Architecture Track Co-Chairs
Jose Moreira, IBM Thomas J. Watson Research Center, USA
Uwe Zdun, Vienna University
of Technology, Austria
Software Evolution Track Co-Chairs
Atilla Elci,
Eastern Mediterranean University, North Cyprus
Hongji Yang, Demontfort University, UK
Testing Track Co-Chairs
Fevzi Belli, University of Paderborn, Germany
Hong Zhu, Oxford Brooks
University, UK
Mobile & Pervasive Computing Track Co-Chairs
Karl Leung, Vocational Training Council , Hong Kong
Zhen Liu, Nokia Research Center , China
Workshop Chair
Sheikh Iqbal Ahamed, Marquette
University, USA
Panel Chair
Rajesh Subramanyan, Siemens Corporate Research, USA
Fast Abstract Chair
Katsunori Oyama, Nihon
University, Japan
Doctoral Symposium Co-Chairs
Jinchun Xia, San Jose State University, USA
Massimo Copolla, CNR, Italy
Technical Program Publicity Chairs
Omer
F. Rana, Cardiff
University, UK
Xianping Tao, Nanjing
University, China
Damla Turgut, University of Central Florida,
USA
More Program Committee Members
Ademar Aguiar, University of Porto, Portugal
Gail-Joon Ahn, Arizona State University, USA
Sabah
Al-Fedaghi, Kuwait University, Kuwait
Mikio Aoyama, Nanzan University, Japan
Paris Avgeriou, University of Groningen, Netherland
Doo-Hwan
Bae, KAIST, Korea
Xiaoying Bai, Tsinghua University, China
Emanuel Baker, USA
Sergey
N. Baranov, Motorola, Russia
Samik Basu, Iowa State University, USA
Paolo
Bellavista, University
of Bologna, Italy
Fausto Bernardini, IBM Watson
Research, USA
Taisuke Boku, Unversity of Tsukuba,
Japan
Jan
Bosch, Intuit Inc., USA
Roberto
Bruni, University
of Pisa, Italy
Kai-Yuan
Cai, Beijing
University of Aeronautics and Astronautics, China
Dave
Card, Q-Labs, France
Barbara
Carminati, University
of Insubria, Italy
Bertrand
du Castel, Schlumberger, USA
Sungduk Cha, Korea University, Korea
Melissa
Chase, Brown University, USA
W.K.
Chan, Hong Kong City University,
Hong Kong
T.Y.
Chen, Swinburne University,
Australia
Y.
C. Chen, National Chiao-Tung University, Taiwan
Chi-Hung
Chi, Tsinghua
University, China
Byoungju Choi, Ewha Woman's University,
Korea
William
Chu, Tunghai
University, Taiwan
Ivica Crnkovic, Malardalen University,
Sweden
James
Cross, Auburn University,
USA
Schahram Dustdar, Technology University of Vienna, Austria
Elena
Ferrari, University of Insubria, Italy
Neil
Harrison, Utah Valley University,
USA
Mohamed
Jemni,University
of Tunis, Tunis
Jun-jang Jeng, IBM TJ Watson, USA
Hsin-yi Jiang, Iowa
State University, USA
T.Ming Jiang, National
Chung Cheng University, Taiwan
Yuecel Karabulut, SAP, USA
Jong Kim, POSTECH, Korea
Markulf Kohlweiss, K.U.Leuven,
Belgium
John
Koo, Shantou University, China
Sanggoo Lee, Seoul
National University, Korea
Joon-Sang Lee,
LG Electronics, Korea
Moonkun Lee, Chonbuk National University, Korea
Woojin Lee, Kyungpook National
University
Ville
Leppanen, University
of Turku and TUCS, Finland
Johan
Lilius, Abo Akademi University, Finland
Jigang Liu, Kyoto
University, Japan
Xiaodong Liu, Napier
University, UK
Xiaoqing (Frank) Liu, Missouri University
of Science and Technology, USA
John
May, University of Bristol,
UK
Nancy Mead, Software Engineering Institute,
CMU
,
USA
Jose
Miguel - Alonso, UPV/EHU University,
Spain
Hua Ming, Iowa State University, USA
P.V.R.
Murthy, Siemens Corporate Technology,
India
Tien Nguyen, Iowa State University, USA
Mehmet A Orgun, Macquarie
University, Australia
Barbara
Paech, University of Heidelberg, Germany
Sooyong Park, Sogang
University, Korea
Daniel
Paulish, Siemens Inc., USA
Frances
Paulisch, Siemens Corporate Technology, Germany
Paul
Pettersson, Malardalen
University, Sweden
Klaus
Pohl, University of Duisburg-Essen, Germany
Shaz Qadeer, Microsoft
Research, USA
Colette
Rolland, University of PARIS-1 Panth谷on Sorbonne, France
Subhash Saini, NASA Ames, USA
Juha Savolainen, Nokia, Finland
Martin
Schulz, Lawrence Livermore National Laboratory, USA
Sahra Sedigh, Missouri
University of Science and Technology, USA
Cristina
Serban, AT&T, USA
Jawed
Siddiqi, Sheffield Hallam
University, UK
Christian
Skalka, University of Vermont, USA
Pradip Srimani, Clemson
University, USA
Michiharu Takemoto, NTT, Japan
Kenji
Takahashi, NTT, Japan
Gene
Tsudik, University of California, Irvine, USA
Hasan Ural, University of Ottawa, Canada
Feng-Jian Wang, National Chiao
Tung University, Taiwan
Qianxiang Wang, Peking University, China
Thomas
Weigert, University of Missouri-Rolla, USA
Gerhard
Wellein, University of Erlangan,
Germany
Will
Winsborough, University of Texas at San Antonio,
USA
Eric
Wong, University Of Texas At Dallas, USA
Dianxiang Xu, North Dakota
State University, USA
Jian Yang, Macquarie University, Australia
Weider Yu, San Jose State University, USA
Y.
T. Yu, City University of Hong Kong, Hong Kong
Jia Zhang, Northern Illinois University, USA
Peter
Zimmerer, Siemens Corporate Technology, Germany
Xukai Zou, IUPUI, USA
Mohammad
Zulkernine, Queen's University, Canada
|