Technical Program Committee

  • Abdelfettah Belghith, University of Manouba
  • Abdelhakim Hafid, University of Montreal
  • Abderrahim Benslimane, University of Avignon
  • Abderrahmane Lakas, UAEU
  • Abderrezak Rachedi, University Paris-Est Marne-la-Vallée
  • Adrian Kliks, Poznan University of Technology
  • Akshya Swain, University of Auckland
  • Alban Duverdier, Centre National D'Etudes Spatiales (CNES)
  • Alberto Zanella, Istituto di Elettronica e di Ingegneria dell’Inform. e delle Telecomunicazioni
  • Alejandro Quintero, Ecole Polytechnique de Montreal
  • Alexey Vinel, Tampere University of Technology
  • Ali Humos, Jackson State University
  • Altair Santin, Pontifical Catholic University of Parana (PUCPR)
  • Alvaro Suárez-Sarmiento, University of Las Palmas de Gran Canaria
  • Amine Maaref, Huawei Technologies Canada
  • Amir Mowlaei, KAR-TECH, Inc.
  • Anand Prasad, NEC Corporation
  • Andrea Baiocchi, University of Roma Sapienza
  • Annie Gravey, Institut Mines Telecom - Telecom Bretagne
  • Antonio Cianfrani, University of Roma "La Sapienza"
  • Antonio Grilo, INESC/IST
  • Bala Natarajan, Kansas State University
  • Barbara Masini, IEIIT-CNR
  • Bhushan Jagyasi, TCS Innovation Labs Mumbai
  • Boris Bellalta, Universitat Pompeu Fabra
  • Brian Sadler, Army Research Laboratory
  • Bulent Tavli, TOBB University of Economics and Technology
  • Carl Debono, University of Malta
  • Chadi Assi, Concordia University
  • Charalampos Tsimenidis, Newcastle University
  • Chi Chung Cheung, The Hong Kong Polytechnic University
  • Chih-Heng Ke, National Kinmen Institute of Technology
  • Chih-Lin Hu, National Central University
  • Chonggang Wang, InterDigital Communications
  • Chris Blondia, University of Antwerp
  • CongDuc Pham, University of Pau
  • Costas Courcoubetis, Athens University of Economics and Business
  • Damianos Gavalas, University of the Aegean
  • Dandan Wang, Alcatel-Lucent
  • David Haccoun, Ecole Polytechnique de Montréal
  • David Lin, National Chiao Tung University
  • David Michelson, University of British Columbia
  • Dhadesugoor Vaman, Priarie View A&M University
  • Di Lin, McGill University
  • Dirk Pesch, Cork Institute of Technology
  • Djamel Djenouri, CERIST research centre, Algiers
  • Eddie Chan, The Hong Kong University of Science and Technology
  • Edmundo Monteiro, University of Coimbra
  • Eduardo Casilari, Universidad de Malaga
  • Edward Au, Huawei Technologies
  • Elsa Macías López, University of Las Palmas de Gran Canaria
  • Enrico Masala, Politecnico di Torino
  • Evangelos Kranakis, Carleton University
  • Evangelos Papapetrou, University of Ioannina
  • Fabrice Theoleyre, CNRS - University of Strasbourg
  • Fabrice Valois, INSA Lyon
  • Felipe Cruz-Pérez, Cinvestav-IPN
  • Feng-Tsun Chien, National Chiao Tung University
  • Fernando Cerdan, Technical University of Cartagena
  • Frank Li, University of Agder
  • George Efthymoglou, University of Piraeus
  • George Karagiannidis, Aristotle University of Thessaloniki
  • Georgios Kambourakis, University of the Aegean
  • Gianluigi Ferrari, University of Parma
  • Guillaume Urvoy-Keller, Université de Nice Sophia-Antipolis
  • Hadi Otrok, Khalifa University of Science, Technology & Research (KUSTAR)
  • Hai Jiang, University of Alberta
  • Hai Lin, Osaka Prefecture University
  • Hamid Sharif, University of Nebraska-Lincoln
  • Hans-Juergen Zepernick, Blekinge Institute of Technology
  • Herwig Bruneel, Ghent University
  • Hidekazu Murata, Kyoto University
  • Hideki Ochiai, Yokohama National University
  • Himal Suraweera, Singapore University of Technology and Design
  • Hongwei Du, Harbin Institute of Technology Shenzhen Graduate School
  • Hui Chen, Virginia State University
  • Husheng Li, University of Tennessee
  • Hyundong Shin, Kyung Hee University
  • Isaac Woungang, Ryerson University
  • Isabelle Demeure, Telecom Paristech
  • Thomas Noel, University of Strasbourg
  • Ivaylo Kostadinov, Quantix
  • Jalel Ben-Othman, University of Paris 13
  • Javier Del Ser, TECNALIA
  • Javier Gozalvez, Universidad Miguel Hernandez de Elche
  • Jelena Mišić, Ryerson University
  • Jesus Alonso-Zarate, Centre Tecnologic de Telecomunicacions de Catalunya - CTTC
  • Jianhua He, Aston University
  • Jiankun Hu, University of New South Wales
  • Jo-Yew Tham, Institute for Infocomm Research, A*STAR
  • Joan Garcia-Haro, Technical University of Cartagena
  • Jogesh K. Muppala, HKUST
  • Jong-Ok Kim, Korea University
  • Jorge Garcia-Vidal, Technical University of Catalonia (UPC)
  • Jose M. Barcelo-Ordinas, Universitat Politècnica de Catalunya (UPC)
  • Karin Hummel, ETH Zurich
  • Kejie Lu, University of Puerto Rico at Mayaguez
  • Khaled El-Maleh, Qualcomm Inc.
  • Khalida Ghanem, CDTA Algeria
  • Kpatcha Bayarou, Fraunhofer Institute for Secure Information Technology
  • Krzysztof Szczypiorski, Warsaw University of Technology
  • Kumudu Munasinghe, University of Sydney
  • Kurt Tutschku, University of Vienna
  • Laura Cottatellucci, EURECOM
  • Lei Shu, Osaka University
  • Liang Hong, Tennessee State University
  • Liang Zhang, Communications Research Centre Canada
  • Ljiljana Trajković, Simon Fraser University
  • Llorenç Cerdà-Alabern, Universitat Politècnica de Catalunya
  • Long Le, INRS, University of Quebec
  • Luca Rugini, University of Perugia
  • Manel Guerrero Zapata, Technical University of Catalonia (UPC)
  • Marco Fiore, INSA Lyon
  • Maria Julia Fernandez-Getino Garcia, University Carlos III of Madrid
  • Maurizio Casoni, University of Modena and Reggio Emilia
  • Maurizio Magarini, Politecnico di Milano
  • Mohammad Banat, Jordan University of Science and Technology
  • Mona Rizvi, Norfolk State University
  • Mujdat Soyturk, Istanbul Technical University
  • Nael Abu-Ghazaleh, State University of New York at Binghamton
  • Nasreddine Lagraa, Amar Thelidji University, Laghouat
  • Nasser-Eddine Rikli, King Saud University
  • Naveen Chilamkurti, La Trobe University
  • Nelson Antunes, University of Algarve
  • Nen-Fu Huang, National Tsing Hua University
  • Nghi Tran, University of Akron
  • Nhut Nguyen, Samsung Telecomms America
  • Nidal Nasser, Alfaisal University
  • Onur Kaya, Isik University
  • Paul Gendron, SSC-Pacific
  • Pavel Loskot, Swansea University
  • Peng-Yong Kong, Khalifa University of Science, Technology & Research (KUSTAR)
  • Periklis Chatzimisios, Alexander TEI of Thessaloniki
  • Peter Langendoerfer, IHP Microelectronics
  • Peter Reiher, UCLA
  • Petteri Mannersalo, VTT Technical Research Centre of Finland
  • Phuoc Tran-Gia, University of Wuerzburg
  • Pingyi Fan, Tsinghua University
  • Polychronis Koutsakis, Technical University of Crete
  • Qiang Ye, University of Prince Edward Island
  • Qin Xin, University of the Faroe Islands
  • Qing-An Zeng, North Carolina A&T State University
  • Rajesh Bodade, Military College of Telecommunication Engineering
  • Ramon Aguero, University of Cantabria
  • Redha Radaydeh, KAUST, TAMUQ
  • Rung-Hung Gau, National Chiao Tung University
  • Sabine Wittevrongel, Ghent University
  • Salil Kanhere, University of New South Wales
  • Sameh Zakhary, University of Nottingham
  • Sangheon Pack, Korea University
  • Seshadri Mohan, University of Arkansas at Little Rock
  • Shiguo Lian, France Telecom R&D Beijing
  • Shonali Krishnaswamy, Monash University
  • Shumao Ou, Oxford Brookes University
  • Sooyoung Kim, Chonbuk National University
  • Stefan Dulman, Delft University of Technology
  • Stefano Avallone, University of Naples
  • Stefanos Gritzalis, University of the Aegean
  • Susana Sargento, Instituto de Telecomunicações, Universidade de Aveiro
  • T. Aaron Gulliver, University of Victoria
  • Tadeusz Czachorski, Institute of Theoretical and Applied Informatics of Polish Academy of Sciences
  • Tao Gu, University of Southern Denmark
  • Terje Jensen, Telenor
  • Thierry Gayraud, LAAS-CNRS, Université de Toulouse
  • Tiffany Jing Li, Lehigh University
  • Tony Q. S. Quek, Institute for Infocomm Research
  • Vicent Pla, Universitat Politecnica de Valencia
  • Vicente Casares-Giner, Universitat Politècnica de Valencia
  • Victor Leung, The University of British Columbia
  • Vishal Anand, The College at Brockport, State University of New York
  • Volker Jungnickel, Fraunhofer Heinrich-Hertz-Institute
  • Véronique Vèque, University of Paris-Sud 11
  • Wee Ser, Nanyang Technological University
  • Wei Ding, New York Institute of Technology
  • Wei Wang, South Dakota State University
  • Weidong Xiang, University of Michigan, Dearborn
  • Weihua Gao, Qualcomm Inc.
  • Weihuang Fu, Cisco Systems
  • Weimin Huang, Memorial University
  • Wen Chen, Shanghai Jiaotong Uuniversity
  • Wessam Ajib, Université du Québec à Montréal
  • Woon Hau Chin, Toshiba Research Europe Limited
  • Xianbo Chen, Broadcom Corporation
  • Xiaolin Chang, Beijing Jiaotong University
  • Yan Zhang, Simula Research Laboratory and University of Oslo
  • Yu Chen, State University of New York - Binghamton
  • Yu-Dong Yao, Stevens Institute of Technology
  • Yue Shang, The MathWorks
  • Yueh-Min Huang, National Cheng Kung University
  • Zhihong Hong, Communications Research Centre
  • Zhou Su, Waseda University
  • Edward Au, Huawei Technologies
  • Stefano Basagni, Northeastern University
  • André-Luc Beylot, IRIT Toulouse
  • Marthinus Booysen, Stellenbosch University
  • Edgar Chavez, Universidad Michoacana
  • Jiming Chen, Zhejiang University
  • Yu Chen, Binghamton University
  • Zhiyong Chen, Shanghai Jiaotong University
  • Zied Chtourou, Department of Electrical Engineering - ENIS- Sfax
  • Vania Conanw, Thales Communications & Security
  • Thierry Delot, University Lille North of France
  • Marcelo Dias de Amorim, UPMC Sorbonne Universités
  • Yacine Ghamri-Doudane, ENSIIE
  • Vasileios Karyotis, National Technical University of Athens
  • Victor Leung, The University of British Columbia
  • Bo Liu, Shanghai Jiao Tong University
  • Jia-Liang Lu, Shanghai Jiao Tong University
  • Naceur Malouch, Université Pierre et Marie Curie - Paris 6
  • Nathalie Mitton, Inria Lille
  • Antonella Molinaro, University Mediterranea of Reggio Calabria
  • Nicolas Montavont, Institut Telecom / Telecom Bretagne
  • Xin Wang, Florida Atlantic University
  • Enrico Natalizio, Université de Technologie de Compiègne
  • Tahiry Razafindralambo, INRIA Lille - Nord Europe
  • Franck Rousseau, Grenoble INP/LIG
  • Ivan Stojmenovic, University of Ottawa
  • Yosuke Tanigawa, Osaka Prefecture University
  • Meixia Tao, Shanghai Jiao Tong University
  • Rui Wang, The South University of Science and Technology of China
  • Chengwen Xing, Beijing Institute of Technology
  • Chau Yuen, Singapore University of Technology and Design
  • Jun Zhang, The Hong Kong University of Science and Technology
  • Caijun Zhong, Zhejiang University

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