The First International Workshop on Engineering Low-Carbon Business (ELCB'10)
(November 10-12, 2010, Shanghai, China, in conjunction with ICEBE 2010 and CEC 2010)
The international workshop on
Engineering Low-Carbon Business (ELCB)
is to provide a prestigious forum
of disseminating innovative findings of e-business relevant issues related to the design,
commercialization and use of services, processes and products that are feasible,
economical, and environmentally friendly. The workshop will cover the theories,
engineering and technological progressions in low carbon research and practices in
facilitating relevant technology and practice adoption to enhance competitiveness
towards enabling efficient and sustainable economy.
The workshop solicits paper
submissions in a wide range of related topics, including, but not limited to,
the following:
- Carbon footprint, accounting, and trading
- Emerging low carbon business models and practices
- Energy efficient computing and enabling technologies
- Monitoring and supervision technologies
- Green organization, technology and practices
- Green ecosystems and sustainable development
- Green facilities, production, and logistics
- RFID and automation
- Standards, regulations, and legal issues
Papers must be submitted electronically. Please submit papers through the following Paper Submission Link:
URL:
http://www.easychair.org/conferences/?conf=elcb2010
The format of submitted papers should follow the guidelines for the IEEE
conference proceedings, limited to 6 pages.
Accepted papers will be published in the workshop proceedings of the ICEBE 2010 by the IEEE CS Press, and will be
further invited for extension for publication in top international journals,
including the International Journal of Applied Logistics (IJAL).
- IMPORTANT DATES
- Abstract registration deadline: June 22, 2010
- Paper submission: July 6, 2010
- Notification of acceptance: July 22, 2010
- Camera-ready paper submission: August 5, 2010
- Workshop Organizer
- Jen-Yao Chung, IBM T.J. Watson Research Center, USA
- Joshua Cooper, Hildebrand, UK
- Zongwei Luo, The Univeristy of Hong Kong, China
- Workshop Program Committee (TBC)
- Kuo-Ming Chao, Coventry University, UK
- Franz Amtmann, NXP, Netherlands
- Gangadharan G.R., Telematica Instituut, Netherlands
- Grahame Cooper, Salford University, UK
- Hongbing Wang, Southeast University, China
- Huiping Sun, Peking University, China
- Kevin Ho, University of Guam, Guam
- Jen-Yao Chung, IBM TJ Watson, USA
- Juan Tapiador, University of York, UK
- Julio C. Hernandez-Castro, Portsmouth University, UK
- Pedro Peris-Lopez, TU-Delft, Netherlands
- Puay Siew Tan, National RFID Center, Singapore
- Sherali zeadally, University of DC, USA
- Sastry Duri, IBM TJ Watson, USA
- Tianle Zhang, BUPT, China
- Tobias Mettler, SAP, Germany
- Vladislav Fomin, Vytautas Magnus University, Lithuania
- William K. Cheung, HK Baptist University, Hong Kong
- Zakaria Maamar, Zayed University, United Arab Emirates
- Zongwei Luo, Hong Kong University, Hong Kong
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