Cloud, mobile and social services are emerging to be the new channels of e-commerce practices nowadays. New engineering technologies for cloud-enabled, mobile-based and social-driven e-Commerce are needed to transform traditional paradigm into a more personalized and data-driven e-Commerce. Today Internet accessiblity and smart devices enable various innovations of well-known commerce models such as Groupon for B2C, Taobao marketplace for C2C. In addition, brand-new innovations are accompanying new e-Commerce as well, for example Bit-coin and Yuebao for 3rd-party based payment tools and platforms. E-Commerce Engineering workshop aims at providing a forum to discuss and present new technologies for aforementioned innovations as well as challenges of conducting new e-Commerce in a more trust, secure and novel manner.

The 2014 International Workshop on E-Commerce Engineering (ECE 2014) seeks for paper submissions in a wide range of related topics including but not limited to the following:

• Cloud, mobile and social technologies for e-Commerce Enginnering
• Security, privacy and trust e-Commerce method, system and platform
• Business analytics of e-Commerce Engineering
• Cloud, mobile and social service architecture and applications
• Innovative business and service models
• API technolgoies for e-Commerce Enginnering

Paper Submission
Papers should be submitted in IEEE conference paper format and should not exceed 6 pages. Each paper will undergo a double-blind review process and typically be reviewed by two to three members of the Program Committee. All papers will be evaluated based on relevance, significance, originality, clarity, and technical merit.

Accepted papers will be included in the conference proceedings of ICEBE 2014, which will be published by IEEE Computer Society and made available in the IEEE Digital Library.

Please submit your paper (in PDF format) through the following link:
URL: Closed

For Inquiry
For additional questions, please contact us at ieeeicebe.1@gmail.com.

Workshop Co-Chairs (ordered by last name alphabetically)

Kuo-Ming Chao, Coventry University, UK

Jen-Yao Chung, IBM, USA

Ci-Wei Lan, IBM, Taiwan

Yinsheng Li, Fudan University, China