Dear Colleagues & Friends:
Because the move created a 7-month gap before the Congress is actually held, the Steering Committee decided to accommodate authors with one more submission window as follows:
The safety and well-being of all conference participants is our priority. We will continue to monitor official travel advisories related to the Corona Virus and update the event website to keep you informed. We encourage you to review the conference’s “Travel Safety & Medical Guidelines” page for tips and travel recommendations provided by IEEE.
The current plan is that CLOUD 2020, in conjunction with the 2020 IEEE World Congress on Services will still be held in Beijing with the following new set of key dates:
Normal paper submission due:
February 13 March 5, 2020 (5:00 am, UTC)
Final notification to authors:
April 6 April 20, 2020
Camera ready manuscripts due:
April 20 June 5, 2020
July 7-11 July 20-24, 2020 October 19-23, 2020
Normal paper submission re-opened for the final window: April 27, 2020
Normal paper submission for the final window due: June 5, 2020 (5:00 am UTC)
Final notification for the final window to authors: July 20, 2020 (for all papers submitted in the final window due June 5)
Camera ready manuscript due: August 7, 2020
Congress Date: October 19-23, 2020
Papers accepted within this final window will also be included in the same 2020 proceedings.
Due to this final move the Congress has issued a newly revised presentation policy for authors and presenters affected by the travel issues.
About IEEE Cloud 2020
The IEEE International Conference on Cloud Computing (CLOUD) has been a prime international forum for both researchers and industry practitioners to exchange the latest fundamental advances in the state of the art and practice of cloud computing, identify emerging research topics, and define the future of cloud computing. All topics regarding cloud computing align with the theme of CLOUD. In 2020, we will gather to strive to advance the largest international professional forum on cloud computing.